High-thermal-conductivity low-dielectric rubber resin material and metal substrate using same

The invention discloses a high-thermal-conductivity low-dielectric rubber resin material and a metal substrate using the same. The rubber resin material comprises a rubber resin composition and a surface modified inorganic filler. The rubber resin composition comprises 30 to 60 weight percent of liquid rubber, 10 to 40 weight percent of polyphenylene ether resin and 10 to 40 weight percent of cross-linking agent, wherein the molecular weight of the liquid rubber is 2500 to 6000 g/mol. The modified functional group of the surface-modified inorganic filler is selected from a group consisting of an acryl group, a nitrogen-containing functional group on a main chain or a branched chain, a double-bond-containing functional group and an epoxy group. The rubber resin material provided by the invention can achieve better heat conductivity, and can keep the dielectric constant and dielectric loss at a lower level in practical application. 本发明公开一种高导热低介电橡胶树脂材料及应用其的金属基板，其中橡胶树脂材料包含一橡胶树脂组成物以及一表面改性无机填料。橡胶树脂组成物包括30重量百分比至60重量