Material returning management method and system of laser chip, electronic equipment and storage medium

The embodiment of the invention discloses a material returning management method and system of a laser chip, electronic equipment and a storage medium. The method comprises the following steps: receiving a material returning request of a laser chip; determining a material returning scheme of the laser chip; the material returning scheme comprises material returning after surface mounting and material returning after wire bonding; the retreated material for surface mounting comprises at least one of a chip retreated material and a heat sink retreated material, and the retreated material for wire bonding comprises at least one of a chip retreated material, a heat sink retreated material and a gold wire retreated material; based on the material returning scheme, the material returning information of the laser chip is generated according to the chip bar code information of the laser chip, so that material returning or scrapping of the laser chip can be executed directly through the material returning information