Leveling and deviation rectifying device for micro-nano attaching/assembling/machining

The invention relates to the technical field of micron-sized chips, and particularly discloses a leveling and deviation rectifying device for micro-nano laminating/assembling/processing, which comprises a device main body, a plurality of lifting assemblies and a plurality of centering assemblies, th...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: TANG HUI, LIU BO, LIAO ZHISHEN
Format: Patent
Sprache:chi ; eng
Schlagworte:
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