Leveling and deviation rectifying device for micro-nano attaching/assembling/machining
The invention relates to the technical field of micron-sized chips, and particularly discloses a leveling and deviation rectifying device for micro-nano laminating/assembling/processing, which comprises a device main body, a plurality of lifting assemblies and a plurality of centering assemblies, th...
Gespeichert in:
Hauptverfasser: | , , |
---|---|
Format: | Patent |
Sprache: | chi ; eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Schreiben Sie den ersten Kommentar!