Leveling and deviation rectifying device for micro-nano attaching/assembling/machining

The invention relates to the technical field of micron-sized chips, and particularly discloses a leveling and deviation rectifying device for micro-nano laminating/assembling/processing, which comprises a device main body, a plurality of lifting assemblies and a plurality of centering assemblies, the device main body comprises a base and a first platform; the multiple centering assemblies are connected with the multiple lifting assemblies. The plurality of lifting assemblies are circumferentially distributed on the base; the centering assembly comprises a ball body, an upper supporting block, a lower supporting block and two supporting columns. The two supporting columns are arranged at the output end of the lifting assembly in a spaced mode. The lower supporting block is flexibly connected with the two supporting columns; a sliding cavity is defined by the upper supporting block and the lower supporting block. The ball body is slidably arranged in the sliding cavity; the first platform is fixedly connected w