Electronic component mounting device

本发明涉及将片型电子元件安装在印刷电路板上的电子元件的安装装置,该装置设置有用于分别驱动配置在工作台(6)两侧的第1、第2供给部(2)、(3)的第1、第2驱动系统(12)、(13),将各供给部的吸附喷嘴(18)、各驱动系统(12)、(13)、供给部的各盒(4)的各自的配置间距设成相同,通过该构成,可获得小型的、可高速安装的电子元件的安装装置。 The present invention relates to an electronic parts mounting device designed to mount chip type electronic parts on a printed...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: TANAKA KUNIO, MUNEZANE TAKASHI, MITSUSHIMA TAKATOSHI
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:本发明涉及将片型电子元件安装在印刷电路板上的电子元件的安装装置,该装置设置有用于分别驱动配置在工作台(6)两侧的第1、第2供给部(2)、(3)的第1、第2驱动系统(12)、(13),将各供给部的吸附喷嘴(18)、各驱动系统(12)、(13)、供给部的各盒(4)的各自的配置间距设成相同,通过该构成,可获得小型的、可高速安装的电子元件的安装装置。 The present invention relates to an electronic parts mounting device designed to mount chip type electronic parts on a printed board. It is an object of the invention to provide a compact and high-speed electronic parts mounting device. To achieve this object, the present invention provides first and second drive systems (12) and (13) for driving first and second supplying portions (2) and (3) arranged on both sides of a table portion (6) and has arrangement pitches of suction nozzles (18) of each supplying portion, each of the drive systems (12) and (13), and each cassette (4) of the supplying portions identical with each other. This structure provides the compact and high-speed electronic parts mounting device.