MicroLED chip array separation process based on laser scribing

The invention discloses a micro LED chip array separation process based on laser scribing, which is characterized in that a micro LED chip array is arranged on a substrate and is separated by a cutting channel, one surface, deviating from the substrate, of the chip array is bonded with a driving substrate, laser cutting is carried out on a cutting channel area by adopting two steps, and the micro LED chip array is separated by the cutting channel. The two cutting grooves are formed in the substrate through one-time laser cutting, the portion, between the two cutting grooves, of the substrate is removed, the driving substrate is cut off through the other-time laser cutting, and therefore the substrate and the driving substrate can have inconsistent cutting edges, on one hand, connecting electrodes, located outside a chip, of the driving substrate are not damaged, and on the other hand, the chip is not damaged; and on the other hand, a position is reserved, so that subsequent probe electric measurement needle i