Tightening ring grabbing and positioning device and wafer processing equipment with same

The invention discloses a tightening ring grabbing and positioning device and wafer processing equipment with the tightening ring grabbing and positioning device. The tightening ring grabbing and positioning device comprises a mounting plate; the multiple clamping jaw positioning mechanisms are arra...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	YI FEIYUE, ZHANG WEIHAN, ZHANG BIAO, YANG SHUNKAI, LI JIDONG
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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