Tightening ring grabbing and positioning device and wafer processing equipment with same
The invention discloses a tightening ring grabbing and positioning device and wafer processing equipment with the tightening ring grabbing and positioning device. The tightening ring grabbing and positioning device comprises a mounting plate; the multiple clamping jaw positioning mechanisms are arra...
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| Format: | Patent |
| Sprache: | chi ; eng |
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| Zusammenfassung: | The invention discloses a tightening ring grabbing and positioning device and wafer processing equipment with the tightening ring grabbing and positioning device. The tightening ring grabbing and positioning device comprises a mounting plate; the multiple clamping jaw positioning mechanisms are arranged in the circumferential direction of the mounting plate at intervals, each clamping jaw positioning mechanism comprises a mounting base, a clamping jaw transmission assembly and a clamping tenon mechanism, the clamping jaw transmission assemblies and the clamping tenon mechanisms are mounted on the mounting bases, and the clamping tenon mechanisms are clamped to the clamping jaw transmission assemblies to limit rotation of the clamping jaw transmission assemblies; the clamping jaw transmission assembly moves along a straight line and pushes the mortise and tenon mechanism to move, and when the mortise and tenon mechanism moves to a preset position, the clamping jaw transmission assembly is not clamped any more, |
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