Packaging structure, chip structure and preparation method thereof

The invention relates to a packaging structure, a chip structure and a preparation method thereof, and the packaging structure comprises a packaging substrate which comprises a grounding conductive part; the plurality of chip groups are located on the packaging substrate, and each chip group comprises a plurality of chips; the first conductive vertical walls are located on the packaging substrate and located on the two sides of the chip set, and the first conductive vertical walls separate the chip set and are connected with the grounding conductive part; the second conductive vertical wall is located between the chips of the same chip set; the dielectric film covers the packaging substrate, the chipset and the side wall of the first conductive vertical wall; the plastic packaging layer is located on the dielectric film, the first conductive vertical wall is exposed, and the second conductive vertical wall is located in the plastic packaging layer; and the conductive layer is located on the plastic packaging