DEVICE BONDING APPARATUS AND METHOD OF MANUFACTURING PACKAGE USING THE SAME

The invention provides a device joining apparatus. The device bonding apparatus includes: a first process station configured to receive a wafer; the first bonding head is configured to carry the crystal grains to the wafer, the first bonding head comprises a first rigid body and a vacuum channel, and the vacuum channel is located in the first rigid body and used for providing adhesive force for carrying the crystal grains to the wafer; and a second bonding head configured to press the die against the wafer, the second bonding head including a second rigid body and an elastic head disposed on the second rigid body for pressing the die, the elastic head having a central portion and an edge portion surrounding the central portion, the central portion of the elastic head having a first thickness, the edge portion of the elastic head has a second thickness greater than the first thickness. 本发明提供一种装置接合设备。所述装置接合设备包括：第一工艺站，被配置成接收晶圆；第一接合头，被配置成将晶粒载送至晶圆，其中第一接合头包括第一刚性体及真空信道，所述真空信道位于第一刚性体中以用于提供将晶粒载送至晶圆的附着力；以及第二接合头，被配置成将晶粒