SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

The invention provides a substrate processing apparatus and a substrate processing method for improving cleanliness of a substrate after supercritical drying. The substrate processing device comprises a liquid processing device, a supercritical drying device, a first loading locking device, a dry cl...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: NAKASHIMA TSUNENAGA, INADOMI HIROAKI
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The invention provides a substrate processing apparatus and a substrate processing method for improving cleanliness of a substrate after supercritical drying. The substrate processing device comprises a liquid processing device, a supercritical drying device, a first loading locking device, a dry cleaning device and a control device. The liquid processing apparatus forms a liquid film on a surface of a substrate. A supercritical drying apparatus dries a substrate by replacing a liquid film with a supercritical fluid. The first load lock device switches a peripheral atmosphere of the substrate from one of an atmospheric pressure atmosphere and a reduced pressure atmosphere to the other of the atmospheric pressure atmosphere and the reduced pressure atmosphere midway along a substrate transport path. The dry cleaning device performs dry cleaning on the surface of the substrate under reduced pressure. The control device sequentially performs the formation of the liquid film by the liquid treatment device, the dr