Method and system for automatically identifying and correcting process deviation of chip

The invention provides a chip process deviation automatic identification and correction method and system, and relates to the technical field of data processing, and the method comprises the steps: obtaining a to-be-glued surface of a chip and a preset gluing thickness; a multi-time gluing procedure is generated; each gluing procedure in the multiple gluing procedures is monitored in real time, multiple sets of real-time monitoring data sets are obtained, and each set of real-time monitoring data set comprises platform rotating speed monitoring data, glue dripping speed monitoring data and glue dripping amount monitoring data; establishing a deviation influence identification network layer, and obtaining a first deviation influence index; an adjustment data set is generated based on the first deviation influence index and used for correcting the gluing control parameters of the next gluing procedure, the technical problem that in the prior art, due to inaccurate monitoring of the gluing quality, the gluing un