High speed interconnect dielectric integrated suspended differential transmission line with ultra wide band common mode rejection

The invention discloses a high-speed interconnection dielectric integrated suspension differential transmission line with ultra wide band common mode rejection, which forms a self-packaging circuit platform through stacking of dielectric substrates. In a self-packaging circuit platform, dielectric d...

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Bibliographische Detailangaben
Hauptverfasser: WANG YONGQIANG, MA KAIXUE, WANG YONGYUN
Format: Patent
Sprache:chi ; eng
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