High speed interconnect dielectric integrated suspended differential transmission line with ultra wide band common mode rejection
The invention discloses a high-speed interconnection dielectric integrated suspension differential transmission line with ultra wide band common mode rejection, which forms a self-packaging circuit platform through stacking of dielectric substrates. In a self-packaging circuit platform, dielectric d...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention discloses a high-speed interconnection dielectric integrated suspension differential transmission line with ultra wide band common mode rejection, which forms a self-packaging circuit platform through stacking of dielectric substrates. In a self-packaging circuit platform, dielectric digging is carried out on stacked dielectric substrates to form an upper cavity and a lower cavity. The two differential coupling transmission lines are located in the upper cavity and the lower cavity respectively, the metal bottom layer exists between the upper differential coupling transmission line and the lower differential coupling transmission line, and the two differential coupling transmission lines and the metal bottom layer form a three-layer main circuit structure. The invention has the following advantages: the dielectric loss is reduced through dielectric cutting and double-layer wiring, and the radiation loss is reduced through self-packaging. The circuit has the characteristic of being easy to expand |
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