Packaging structure capable of avoiding line arc deformation and packaging method thereof

The invention belongs to the technical field of photoelectric devices, and discloses a packaging structure capable of avoiding wire arc deformation and a packaging method thereof.The packaging structure comprises an LED assembly and a packaging adhesive layer set, the LED assembly comprises an LED chip, a metal wire and a support, the LED chip is arranged on the support, and the LED chip is electrically connected with the support through the metal wire; the packaging adhesive layer group comprises a first packaging adhesive layer and a second packaging adhesive layer, and the first packaging adhesive layer wraps the metal wire and is used for preventing the metal wire from arc deformation; the second packaging adhesive layer covers the LED chip and the first packaging adhesive layer; according to the invention, the metal wire is effectively wrapped by the first packaging adhesive layer, and the LED chip and the first packaging adhesive layer are covered by the second packaging adhesive layer, so that the LED