Printed circuit board (PCB) laser board splitting machine and board splitting method

The invention belongs to the technical field of PCB splitting, and particularly relates to a PCB laser splitting machine and a PCB splitting method. The PCB laser splitting machine comprises a conveying device, a feeding grabbing device, a plurality of moving devices, a plurality of laser processing devices and a discharging grabbing device, wherein the moving devices are respectively provided with corresponding carriers; feeding and discharging are carried out in a grabbing mode, and feeding and discharging can be conveniently carried out on PCBs with uneven surfaces. The carrier comprises an x-direction distance expanding mechanism which can perform x-direction distance expanding on the cut PCBs; and the discharging grabbing device comprises a y-direction distance expanding mechanism, and y-direction distance expanding can be carried out after the PCBs are grabbed. 本发明属于PCB板分板技术领域，具体涉及一种PCB板激光分板机及分板方法。该PCB板激光分板机包括：输送装置、上料抓取装置、若干分别设置有相应载具的移动装置、若干激光加工装置、下料抓取装置；通过抓取方式上下料，可以便于对表面凹凸不平的PCB板进行上下料；且载具包括x向扩距机构，可以对切割