Multilayer substrate, method for manufacturing multilayer substrate, and electronic device

The first conductor layer is in contact with the first interlayer connection conductor and the second interlayer connection conductor. The composition of the first conductor layer is the same as the composition of the first interlayer connection conductor and the composition of the second interlayer...

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1. Verfasser:	IKEMOTO NOBUO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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