Multilayer substrate, method for manufacturing multilayer substrate, and electronic device
The first conductor layer is in contact with the first interlayer connection conductor and the second interlayer connection conductor. The composition of the first conductor layer is the same as the composition of the first interlayer connection conductor and the composition of the second interlayer...
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| Format: | Patent |
| Sprache: | chi ; eng |
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| Zusammenfassung: | The first conductor layer is in contact with the first interlayer connection conductor and the second interlayer connection conductor. The composition of the first conductor layer is the same as the composition of the first interlayer connection conductor and the composition of the second interlayer connection conductor. The one or more first metal foil layers are in contact with the third main surface of the first conductor layer. The one or more first metal foil layers overlap the first interlayer connection conductor and the second interlayer connection conductor when viewed in the first direction. The one or more second metal foil layers overlap the first interlayer connection conductor and the second interlayer connection conductor when viewed in the first direction, and are electrically connected to the first interlayer connection conductor and the second interlayer connection conductor. The composition of the one or more second metal foil layers is different from the composition of the first conductor |
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