Package with inductor and method of forming inductor

A method of forming an inductor includes forming a first redistribution structure on a substrate, forming a first conductive via over and electrically connected to the first redistribution structure, depositing a first magnetic material over a top surface and sidewalls of the first conductive via, and forming a second magnetic material over the top surface and sidewalls of the first conductive via. Coupling the first die and the second die to the first redistribution structure, sealing the first die, the second die, and the first conductive via in an encapsulant, and planarizing the encapsulant and the first magnetic material to expose a top surface of the first conductive via while a remaining portion of the first magnetic material remains on sidewalls of the first conductive via, wherein the first conductive via and the remaining portion of the first magnetic material provide an inductor. The embodiment of the invention also relates to a package with the inductor. 一种形成电感器的方法，包括在衬底上形成第一重分布结构，形成位于第一重分布结构上方并且电