Manufacturing method of high-flatness low-color-difference solder mask layer circuit board

The invention discloses a method for manufacturing a high-flatness low-color-difference solder mask circuit board, which comprises the following steps of: screen-printing a black first ink layer on a circuit board to be processed, exposing the first ink layer through a film, correspondingly covering a distribution area of a surface circuit with a shading area, correspondingly covering other areas of the surface of the circuit board to be processed with a light-transmitting area, and processing to form a first solder mask layer circuit board, carrying out surface roughening treatment, and carrying out overall silk-screen printing of a black second ink layer to manufacture the high-flatness low-color-difference solder mask layer circuit board. According to the invention, the height difference between the surface circuit and the surface of the insulating dielectric layer is reduced by manufacturing the first solder resist pattern, and then the second ink layer is manufactured, so that the circuit board with high