Manufacturing method of high-integration precision circuit board

The invention discloses a method for manufacturing a high-integration precision circuit board, which comprises the following steps of: designing a circuit board comprising an effective area and an auxiliary area, and pre-enlarging the auxiliary area to form a jointed circuit board; carrying out previous procedure processing, drilling processing, full-board electroplating processing and baking processing to form a board circuit board; performing plug hole processing and segmented baking processing to form a plug hole circuit board; carrying out polishing processing to form a polished circuit board; performing circuit pattern processing, dehumidifying and baking to form a circuit pattern circuit board; a solder resist ink layer is manufactured in an electrostatic spraying mode, and a solder resist layer circuit board is formed; manufacturing a solder mask pattern to form a high-integration precision circuit board; by increasing the design of an auxiliary area, conducting hole plugging after full-board electropl