Electronic structure and manufacturing method thereof

The invention provides an electronic structure and a manufacturing method thereof. The electronic structure includes a substrate, a plurality of conductors, a bump structure, and a protective layer. The conductor is arranged on the substrate. The bump structure is disposed on at least one of the conductors. And the protective layer is arranged on the conductor. A region is exposed between the conductors. The invention also provides a manufacturing method of the electronic structure. 本发明提供一种电子结构及其制造方法。所述电子结构包括一基板、多个导体、一凸块结构、以及一保护层。所述导体设置于所述基板上。所述凸块结构设置于所述导体的至少其中一个上。所述保护层设置于所述导体上。一区域露出于所述导体之间。本发明另提供一种电子结构的制造方法。