Thermally conductive electronic package

Apparatuses and methods for configuring a circuit board with a plurality of dies having different bottom side potentials are disclosed herein. An apparatus includes a circuit board including a metal substrate, a thermally conductive dielectric, and a plurality of metal pads. Each of a plurality of d...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	WALLNER ANDREAS, GOLLIN KIRSTEN, RAUTOJA, ERKKI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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