Thermally conductive electronic package

Apparatuses and methods for configuring a circuit board with a plurality of dies having different bottom side potentials are disclosed herein. An apparatus includes a circuit board including a metal substrate, a thermally conductive dielectric, and a plurality of metal pads. Each of a plurality of dies of the device is coupled to a respective one of the plurality of metal pads, and the plurality of dies includes a first die and a second die. The first die is configured to exhibit a first bottom side potential and the second die is configured to exhibit a second bottom side potential based on each of the plurality of dies being coupled to a respective one of the plurality of metal foil pads. The apparatus is further configured to conduct heat from the plurality of dies away from the plurality of dies via at least the metal substrate, the thermally conductive dielectric, and the plurality of metal pads. 本文公开了用于将电路板配置为具有多个具有不同底侧电位的管芯的设备和方法。一种设备包括电路板，所述电路板包括金属基板、导热电介质和多个金属焊盘。所述设备的多个管芯中的每一个管芯耦接到所述多个金属焊盘中相应的金属焊盘，并且