Heat dissipation in ultrasound probe

An ultrasound imaging apparatus includes a housing having an outer surface and an inner surface. The outer surface is grasped by a user. The apparatus includes an array of acoustic elements that emit ultrasonic energy and receive ultrasonic echoes. The array is located at an end of the housing. The...

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Bibliographische Detailangaben
Hauptverfasser: MYERS, JERE, W, MANNING, ROBERT, M, CLARK DENNIS DEAN
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:An ultrasound imaging apparatus includes a housing having an outer surface and an inner surface. The outer surface is grasped by a user. The apparatus includes an array of acoustic elements that emit ultrasonic energy and receive ultrasonic echoes. The array is located at an end of the housing. The apparatus includes a heat sink located within the housing and receiving heat generated by the array. The apparatus includes a heat pipe located within the housing and transferring heat away from an end of the housing. The device includes a heat dissipating material located on an inner surface of the housing and dissipating heat. A distal portion of the heat pipe is in thermal contact with the heat sink, and a proximal portion of the heat pipe is in thermal contact with the heat dissipating material. The proximal portion and the distal portion have a flat profile. 一种超声成像装置包括壳体,其具有外表面和内表面。外表面由用户抓握。该装置包括发射超声能量和接收超声回波的声学元件阵列。该阵列位于壳体的端部。该装置包括位于壳体内且接收由阵列产生的热量的散热器。该装置包括位于壳体内且将热量远离壳体的端部传送的热管。该装置包括位于壳体的内表面上且消散掉热量的散热材料。热管的远侧