Low-light-decay anti-tarnish bonding silver wire and preparation method thereof

The invention discloses a low-light-decay anti-discoloration bonded silver wire and a preparation method thereof. The bonded silver wire comprises the following components in percentage by mass: 5-10 ppm of strontium, 7-15 ppm of calcium, 10-20 ppm of beryllium, 5-10 ppm of zinc, 5-10 ppm of zinc, 5...

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Bibliographische Detailangaben
Hauptverfasser:	LI RUOJING, ZHOU WENYAN, YANG ANHENG, WANG JIA, PEI HONGYING, WANG ZHAO, KONG JIANWEN, KANG FEIFEI, LIANG CHEN, LUO FANGLING, WU YONGJIN, DU WENJING, CUI BO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ALLOYS AUXILIARY OPERATIONS USED IN CONNECTION WITH METAL-WORKINGWITHOUT ESSENTIALLY REMOVING MATERIAL BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FERROUS OR NON-FERROUS ALLOYS INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL MANUFACTURE OF METAL SHEETS, WIRE, RODS, TUBES OR PROFILES,OTHERWISE THAN BY ROLLING MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVINGMATERIAL METALLURGY MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25 NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE PERFORMING OPERATIONS PUNCHING METAL SEMICONDUCTOR DEVICES TRANSPORTING TREATMENT OF ALLOYS OR NON-FERROUS METALS
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Beschreibung
Zusammenfassung:	The invention discloses a low-light-decay anti-discoloration bonded silver wire and a preparation method thereof. The bonded silver wire comprises the following components in percentage by mass: 5-10 ppm of strontium, 7-15 ppm of calcium, 10-20 ppm of beryllium, 5-10 ppm of zinc, 5-10 ppm of zinc, 5-10 ppm of zinc, and the balance of silver. The content of gold is 5-15 ppm, and the content of palladium is 5-15 ppm; the content of cerium is 1 to 20 ppm; the raw material purity of the silver is 99.99%. For the bonding silver wire with the diameter smaller than phi 0.050 mm, an on-line hot drawing and step-by-step surface preparation mode with the deformation gradually decreased is designed, the component and concentration ratio of an anti-tarnish surface active agent are designed, and the low-light-decay anti-tarnish bonding silver wire is prepared. The average luminous flux value of the bonded silver wire prepared by the method reaches 28.791 m, the surface is bright and does not change color after a high-temp