Wafer level semiconductor device with wettable flanks

The invention provides a wafer level semiconductor device with wettable flanks. A semiconductor device includes a semiconductor wafer having an upper surface with one or more electrical contacts formed thereon and an opposing bottom surface. A molding material encapsulates the upper surface and at least a portion of the side surfaces of the semiconductor wafer. The molding material defines an encapsulation having an upper surface and a side surface. An opening is formed on the upper surface of the package, and an electrical contact is partially exposed from the molding material through the opening. A metal layer is formed over the electrical contact and electrically connected to the electrical contact through the opening. A metal layer extends to the side surface of the package and at least partially covers the side surface of the package. 本公开提供了带有可湿润侧翼的晶圆级半导体装置。一种半导体装置包括：半导体晶片，其具有上表面和相对的底面，上表面上形成有一个或多个电触点。模制材料封装所述半导体晶片的所述上表面和至少一部分侧表面。所述模制材料限定具有上表面和侧表面的封装体。开口形成在所述封装体的所述上表面上，并且电触点通过所述开口从所述模制材料部分地暴露出来。金属层形成在所述电