Manufacturing method for laser drilling of thick copper PCB

The invention discloses a manufacturing method for laser drilling of a thick copper PCB, and relates to the technical field of PCB manufacturing. Comprising the following steps: S1, cutting; s2, obtaining an inner layer pattern; s3, performing AOI on the inner layer; s4, performing press fit; s5, edge milling; s6, blind hole windowing; s7, blind hole AOI is carried out; s8, laser drilling is conducted; s9, drilling is conducted; s10, copper deposition; s11, VCP electroplating is carried out; s12, drawing an outer layer pattern; s13, carrying out AOI on the outer layer; s14, resistance welding is carried out; s15, obtaining characters; s16, performing chemical gold plating; s17, performing a flying probe test; s18, four-wire testing is carried out; s19, forming is conducted; and S20, visual inspection. The laser blind hole obtained through the thick copper PCB laser drilling manufacturing method is beautiful in shape, laser glue removal of the bottom of the hole is clean, a production method is provided for th