Photon detector chip and method for manufacturing low-temperature elargol solder on photon detector chip

The invention discloses a photon detector chip and a method for manufacturing low-temperature elargol solder on the photon detector chip. The manufacturing method comprises the steps of obtaining a photon detector chip, wherein the photon detector chip comprises a plurality of bonding pads located o...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: HE MINGJIAN, YANG RIGUI, YU GONGCHI
Format: Patent
Sprache:chi ; eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:The invention discloses a photon detector chip and a method for manufacturing low-temperature elargol solder on the photon detector chip. The manufacturing method comprises the steps of obtaining a photon detector chip, wherein the photon detector chip comprises a plurality of bonding pads located on the same surface; manufacturing conductive salient points on a part of the bonding pad, and enabling the heights of the conductive salient points to be the same; forming low-temperature silver colloid liquid drops on each bonding pad; leveling the low-temperature silver adhesive liquid drops by using the conductive bumps, so that the low-temperature silver adhesive liquid drops are consistent in height and are table-shaped; and solidifying the low-temperature silver colloid liquid drops to form the table-shaped low-temperature silver colloid solder with the same height. The conductive salient points with the same height are manufactured on part of the bonding pads, then the low-temperature silver adhesive liquid