Method for controlling hot melt adhesive applying amount

The invention discloses a hot melt adhesive applying amount control method, and relates to the technical field of plate processing, the hot melt adhesive applying amount control method comprises a conveying line, an adhesive applying device, a measuring device and a hot melt adhesive machine, the ad...

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Bibliographische Detailangaben
Hauptverfasser:	KE JIANSHENG, PENG JIANWEI, RUAN JUNBING, LIU MENGZI, YE PING, ZHENG ZHIHUA, LIU RUIZENG
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL PERFORMING OPERATIONS SPRAYING OR ATOMISING IN GENERAL TRANSPORTING
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Beschreibung
Zusammenfassung:	The invention discloses a hot melt adhesive applying amount control method, and relates to the technical field of plate processing, the hot melt adhesive applying amount control method comprises a conveying line, an adhesive applying device, a measuring device and a hot melt adhesive machine, the adhesive applying device is in butt joint with the conveying line, the measuring device is located between the adhesive applying device and the conveying line, the hot melt adhesive machine is installed on the adhesive applying device, and the measuring device is located between the adhesive applying device and the conveying line. A measuring device is used for recording the total meter number of the plate to be subjected to edge sealing within a certain time, the improved hot melt glue machine is used for recording the rated glue outlet amount of the glue within the corresponding time, and therefore the glue outlet amount of the glue within the certain time is calculated; the glue layer thickness controller controls