Laminated curable resin structure, dry film, cured product, and electronic component

Provided is a laminated curable resin structure with which it is possible to obtain a cured product having high resolution, excellent crack resistance, and excellent adhesion to a metallized layer. A laminated curable resin structure comprising two resin layers in which an X layer comprising an alkali-soluble resin composition X and a Y layer comprising an alkali-soluble resin composition Y are laminated, the X layer being laminated on the Y layer, the X layer being 5-30% of the thickness of the whole of the two resin layers together with the Y layer, and the Y layer being 5-30% of the thickness of the whole of the two resin layers together with the Y layer. The laminated curable resin structure has a thermal expansion coefficient of 110 ppm/DEG C or less at 200-250 DEG C as determined by thermomechanical analysis in a cured product having a thickness of 20-30 [mu] m as determined by irradiation with light at 1000 mJ/cm2 and heat treatment at 160 DEG C for 1 hour. 提供：能得到高分辨率、和耐裂纹性、与镀金属层的密合性优异的固化物的层叠固化性树脂结构体。一