WIRING BOARD AND METHOD FOR MANUFACTURING WIRING BOARD

A wiring substrate is provided with: a transparent substrate; a mesh wiring portion disposed on the substrate and including a plurality of wirings; and a dummy wiring portion disposed around the mesh wiring portion and including a plurality of dummy wirings electrically independent of the wiring. Th...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: KINOSHITA KAZUKI, IIMURA KEITA, KAWAGUCHI SHUJI, TAKE SEIJI, IIOKA HIDETOSHI
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:A wiring substrate is provided with: a transparent substrate; a mesh wiring portion disposed on the substrate and including a plurality of wirings; and a dummy wiring portion disposed around the mesh wiring portion and including a plurality of dummy wirings electrically independent of the wiring. The mesh wiring portion is configured from predetermined unit patterns repeatedly arranged in a first direction. In the first direction, the interval between the mesh wiring portion and the dummy wiring portion is 0.01 times or more and 0.2 times or less of the pitch of the unit pattern in the first direction. 布线基板具备:具有透明性的基板;网状布线部,其配置在基板上,包含多个布线;以及虚设布线部,其配置在网状布线部的周围,包含与布线在电气上独立的多个虚设布线。网状布线部由沿着第1方向重复排列的规定的单位图案构成。在第1方向上,网状布线部与虚设布线部之间的间隔为单位图案在第1方向上的间距的0.01倍以上且0.2倍以下。