Method and system for optimizing copper plating waste liquid treatment process
The invention provides an optimization method and system for a copper plating waste liquid treatment process, and relates to the technical field of waste liquid treatment.The optimization method comprises the steps that a waste liquid data set is obtained, and a sample database is constructed for th...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention provides an optimization method and system for a copper plating waste liquid treatment process, and relates to the technical field of waste liquid treatment.The optimization method comprises the steps that a waste liquid data set is obtained, and a sample database is constructed for the data set generated by executing multi-point sampling after copper plating waste liquid is evenly treated and sample waste liquid is treated through a microwave advanced oxidation process, each processing result has parameter mapping, a sample database has uniform concentration identification, a sample parameter optimization space under each uniform concentration is established, adjacent uniform concentration sample aggregation is executed, aggregation result matching of sample aggregation is carried out, a matching point is positioned, a compensation parameter is generated, and process optimization of the copper plating waste liquid is carried out through the compensation parameter. The technical problem that in |
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