Electronic device and power module
A power module is provided with an element (3) and an insulating circuit board (2) having a laminated portion. The laminated portion includes a first metal layer (21), a bonding layer interposed between the element (3) and the first metal layer (21), a second metal layer (23), and a resin layer (22)...
Gespeichert in:
Hauptverfasser: | , , , |
---|---|
Format: | Patent |
Sprache: | chi ; eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | A power module is provided with an element (3) and an insulating circuit board (2) having a laminated portion. The laminated portion includes a first metal layer (21), a bonding layer interposed between the element (3) and the first metal layer (21), a second metal layer (23), and a resin layer (22) interposed between the first metal layer (21) and the second metal layer (23). The insulating circuit board (2) is provided with a pair of laminated sections provided so as to sandwich the element (3). The laminated part is configured in such a manner that the ultrasonic pulse emitted from the outside of the second metal layer (23) to the element (3) has the following detection time relationship. The time during which the ultrasonic pulse reciprocates twice in the second metal layer (23) is longer than the time during which the ultrasonic pulse reciprocates once from the second metal layer (23) to the element (3).
功率模块具备元件(3)以及具有层叠部的绝缘电路基板(2)。层叠部包含第一金属层(21)、夹设于元件(3)与第一金属层(21)之间的接合层、第二金属层(23)、以及夹设于第一金属层(21)与第二金属层(2 |
---|