Heat dissipation structure capable of reducing heat conduction resistance

The invention discloses a heat dissipation structure capable of reducing heat conduction resistance, which comprises a heat dissipation body with a cavity, a PCBA (Printed Circuit Board Assembly), a chip and a heat conduction boss, an elastic piece is sleeved on the PCBA, the PCBA is arranged in the heat dissipation body and can vertically float in the cavity of the heat dissipation body through the elastic piece, the chip is fixedly arranged on the PCBA, and the heat conduction boss is arranged on the heat dissipation body. The heat conduction boss extends towards the chip along the inner surface, opposite to the chip, of the heat dissipation body, and the chip is attached to the heat conduction boss in the vertical floating process of the PCBA along the cavity. The PCBA is sleeved with the elastic piece, so that the PCBA vertically floats in the compression process of the elastic piece, the chip is attached to the heat conduction boss in a zero-gap mode, the contact thermal resistance of the heat conduction