Wafer fan-out packaging method and packaging equipment

The invention provides a wafer fan-out packaging method and packaging equipment, and relates to the technical field of wafer fan-out packaging. The wafer fan-out packaging method comprises the steps that a carrier plate with a flip chip is provided, and the face, with a bonding pad, of the flip chip faces the carrier plate; and acquiring the central position of one surface of the flip chip, which is provided with the bonding pad, by adopting an infrared polarization module. Calculating a difference value between the central position and a preset position; and moving the flip chip according to the difference value, so that the difference value between the central position and the preset position is within a preset range. And carrying out plastic packaging on the flip chip. Infrared detection positioning is performed on the flip chip before plastic packaging of the flip chip, and the flip chip which is positioned to deviate is moved, so that the chip mounting precision is improved, and the subsequent wiring pre