Substrate processing method and substrate processing apparatus

The invention provides a substrate processing method and a substrate processing apparatus. A liquid film of a water repellent agent, which covers the entire surface of a substrate (W), is formed by supplying a liquid of the water repellent agent to the surface of the substrate (W). Subsequently, a l...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: OATO AKIRA, TANAKA TAKAYOSHI
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The invention provides a substrate processing method and a substrate processing apparatus. A liquid film of a water repellent agent, which covers the entire surface of a substrate (W), is formed by supplying a liquid of the water repellent agent to the surface of the substrate (W). Subsequently, a liquid of a first organic solvent having a lower surface tension than water is supplied to the surface of the substrate (W) covered by the liquid film of the water repellent agent, thereby replacing the liquid of the water repellent agent on the substrate (W) with the liquid of the first organic solvent. Then, a liquid of a second organic solvent having a lower surface tension than the surface tension of the first organic solvent is supplied to the surface of the substrate (W) covered by the liquid film of the first organic solvent, thereby replacing the liquid of the first organic solvent on the substrate (W) with the liquid of the second organic solvent. Thereafter, the substrate (W) to which the liquid of the sec