Thin film type enclosure system
The invention relates to a thin film type enclosure system which is distributed in a plane area, a corner area with two intersected faces and a corner area with three intersected faces and comprises a main layer sealing layer, a main layer heat insulation layer, a secondary layer sealing layer and a...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention relates to a thin film type enclosure system which is distributed in a plane area, a corner area with two intersected faces and a corner area with three intersected faces and comprises a main layer sealing layer, a main layer heat insulation layer, a secondary layer sealing layer and a secondary layer heat insulation layer. The main heat insulation layer and the secondary heat insulation layer are connected through a connecting piece; the secondary heat insulation layer is bonded and mounted on the ship body structure; the main heat insulation layer comprises a first plywood, a first insulation layer, a second plywood and a second insulation layer which are arranged in sequence; the secondary heat insulation layer comprises a third plywood, a third insulation layer and a fourth plywood which are arranged in sequence; and glass wool is filled between the main-layer heat insulation modules and between the secondary-layer heat insulation modules. By means of the special hierarchical structure arran |
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