Cooling body for electrical and/or electronic assembly

The invention relates to a heat sink (1) for an electrical and/or electronic assembly, in particular for an electric or hybrid vehicle, the heat sink (1) comprising at least one base plate (2) and at least one cover plate (3), a stack (4) of intermediate plates (10, 20) being arranged between the ba...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: BAKER MICHAEL F, PAEHRISCH MICHAEL, KIENLE WOLFGANG, SCHULLER MARCUS
Format: Patent
Sprache:chi ; eng
Schlagworte:
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Beschreibung
Zusammenfassung:The invention relates to a heat sink (1) for an electrical and/or electronic assembly, in particular for an electric or hybrid vehicle, the heat sink (1) comprising at least one base plate (2) and at least one cover plate (3), a stack (4) of intermediate plates (10, 20) being arranged between the base plate (2) and the cover plate (3), wherein the stack (4) comprises at least one first intermediate plate (10) and at least one second intermediate plate (20), a plurality of first cutouts (11) being formed in the first intermediate plate (10), and a plurality of second cutouts (21) being formed in the second intermediate plate (20), a cooling channel (5) in the cooling body (1) for conducting a cooling fluid through the cooling body (1) is formed by a first recess (11) in the first intermediate plate (10) and a second recess (21) in the second intermediate plate (20), the cooling channel (5) extending from an inlet (8) of the cooling body (1) to an outlet (9) of the cooling body (1), and the cooling channel (5)