Circuit board

The invention discloses a circuit board, which comprises a circuit layer and a uniform temperature layer, the uniform temperature layer comprises a first metal plate body, a second metal plate body, at least one capillary structure and at least one supporting structure, and the first metal plate bod...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	GUO MINGFENG, LIU MINKUI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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