Circuit board

The invention discloses a circuit board, which comprises a circuit layer and a uniform temperature layer, the uniform temperature layer comprises a first metal plate body, a second metal plate body, at least one capillary structure and at least one supporting structure, and the first metal plate body of the uniform temperature layer is combined with one surface of the circuit layer, so that the circuit layer and the uniform temperature layer are combined into a whole. The circuit board is mainly used for heat transfer, heat conduction and heat dissipation, the circuit board and the vapor chamber are integrated, the heat transfer and heat conduction effect is effectively improved, the heat dissipation requirement of an existing circuit board can be met, meanwhile, the internal and external strength and thickness of a vapor chamber cavity are increased, it can be guaranteed that deformation does not occur in the production process, and the structure is more stable. 本发明公开一种电路板，包括一线路层及一均温层，均温层包含一第一金属板体、一第二金属板体、至少