Simple vertical interconnection method and device based on anisotropic conductive adhesive and substrate
The invention provides a simple vertical interconnection method and device based on an anisotropic conductive adhesive, and a substrate. The method comprises the following steps: carrying out a preparation process on an organic interconnection substrate; manufacturing metal layers on the upper surfa...
Gespeichert in:
| Hauptverfasser: | , , , |
|---|---|
| Format: | Patent |
| Sprache: | chi ; eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | XIA YANG PENG TIANFANG HAN YINGZHOU QIAO YUYANG |
| description | The invention provides a simple vertical interconnection method and device based on an anisotropic conductive adhesive, and a substrate. The method comprises the following steps: carrying out a preparation process on an organic interconnection substrate; manufacturing metal layers on the upper surface and the lower surface of the organic interconnection substrate; drilling holes in preset positions of the organic interconnection substrate by using a drilling machine to form through holes, and depositing metal in the through holes of the organic interconnection substrate; attaching the anisotropic conductive adhesive to the upper surface of the organic interconnection substrate; the insulation plane of the anisotropic conductive adhesive is parallel to the upper surface, and the conduction direction is vertical to the upper surface; patterning the metal layers on the upper surface and the lower surface of the organic interconnection substrate; and aligning a pre-prepared chip with the organic interconnection s |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN117059498A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN117059498A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN117059498A3</originalsourceid><addsrcrecordid>eNqNy0EKwjAUBNBuXIh6h-8BBIuKdilFceVG9-U3mdIPbRKS357fIB7A1QzMvGXRv2QMA2hGVDE8kDhFNN45GBXvaIT23hI7SxazGFDLCZbyxE6S1-iDGMrCTlnMILY90rdkk6Y2aWTFulh0PCRsfrkqtvfbu37sEHyDFNjAQZv6WZbn_ak6Vpfr4Z_PB3IGQTU</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Simple vertical interconnection method and device based on anisotropic conductive adhesive and substrate</title><source>esp@cenet</source><creator>XIA YANG ; PENG TIANFANG ; HAN YINGZHOU ; QIAO YUYANG</creator><creatorcontrib>XIA YANG ; PENG TIANFANG ; HAN YINGZHOU ; QIAO YUYANG</creatorcontrib><description>The invention provides a simple vertical interconnection method and device based on an anisotropic conductive adhesive, and a substrate. The method comprises the following steps: carrying out a preparation process on an organic interconnection substrate; manufacturing metal layers on the upper surface and the lower surface of the organic interconnection substrate; drilling holes in preset positions of the organic interconnection substrate by using a drilling machine to form through holes, and depositing metal in the through holes of the organic interconnection substrate; attaching the anisotropic conductive adhesive to the upper surface of the organic interconnection substrate; the insulation plane of the anisotropic conductive adhesive is parallel to the upper surface, and the conduction direction is vertical to the upper surface; patterning the metal layers on the upper surface and the lower surface of the organic interconnection substrate; and aligning a pre-prepared chip with the organic interconnection s</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20231114&DB=EPODOC&CC=CN&NR=117059498A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,777,882,25545,76296</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20231114&DB=EPODOC&CC=CN&NR=117059498A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>XIA YANG</creatorcontrib><creatorcontrib>PENG TIANFANG</creatorcontrib><creatorcontrib>HAN YINGZHOU</creatorcontrib><creatorcontrib>QIAO YUYANG</creatorcontrib><title>Simple vertical interconnection method and device based on anisotropic conductive adhesive and substrate</title><description>The invention provides a simple vertical interconnection method and device based on an anisotropic conductive adhesive, and a substrate. The method comprises the following steps: carrying out a preparation process on an organic interconnection substrate; manufacturing metal layers on the upper surface and the lower surface of the organic interconnection substrate; drilling holes in preset positions of the organic interconnection substrate by using a drilling machine to form through holes, and depositing metal in the through holes of the organic interconnection substrate; attaching the anisotropic conductive adhesive to the upper surface of the organic interconnection substrate; the insulation plane of the anisotropic conductive adhesive is parallel to the upper surface, and the conduction direction is vertical to the upper surface; patterning the metal layers on the upper surface and the lower surface of the organic interconnection substrate; and aligning a pre-prepared chip with the organic interconnection s</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNy0EKwjAUBNBuXIh6h-8BBIuKdilFceVG9-U3mdIPbRKS357fIB7A1QzMvGXRv2QMA2hGVDE8kDhFNN45GBXvaIT23hI7SxazGFDLCZbyxE6S1-iDGMrCTlnMILY90rdkk6Y2aWTFulh0PCRsfrkqtvfbu37sEHyDFNjAQZv6WZbn_ak6Vpfr4Z_PB3IGQTU</recordid><startdate>20231114</startdate><enddate>20231114</enddate><creator>XIA YANG</creator><creator>PENG TIANFANG</creator><creator>HAN YINGZHOU</creator><creator>QIAO YUYANG</creator><scope>EVB</scope></search><sort><creationdate>20231114</creationdate><title>Simple vertical interconnection method and device based on anisotropic conductive adhesive and substrate</title><author>XIA YANG ; PENG TIANFANG ; HAN YINGZHOU ; QIAO YUYANG</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN117059498A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2023</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>XIA YANG</creatorcontrib><creatorcontrib>PENG TIANFANG</creatorcontrib><creatorcontrib>HAN YINGZHOU</creatorcontrib><creatorcontrib>QIAO YUYANG</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>XIA YANG</au><au>PENG TIANFANG</au><au>HAN YINGZHOU</au><au>QIAO YUYANG</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Simple vertical interconnection method and device based on anisotropic conductive adhesive and substrate</title><date>2023-11-14</date><risdate>2023</risdate><abstract>The invention provides a simple vertical interconnection method and device based on an anisotropic conductive adhesive, and a substrate. The method comprises the following steps: carrying out a preparation process on an organic interconnection substrate; manufacturing metal layers on the upper surface and the lower surface of the organic interconnection substrate; drilling holes in preset positions of the organic interconnection substrate by using a drilling machine to form through holes, and depositing metal in the through holes of the organic interconnection substrate; attaching the anisotropic conductive adhesive to the upper surface of the organic interconnection substrate; the insulation plane of the anisotropic conductive adhesive is parallel to the upper surface, and the conduction direction is vertical to the upper surface; patterning the metal layers on the upper surface and the lower surface of the organic interconnection substrate; and aligning a pre-prepared chip with the organic interconnection s</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | chi ; eng |
| recordid | cdi_epo_espacenet_CN117059498A |
| source | esp@cenet |
| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | Simple vertical interconnection method and device based on anisotropic conductive adhesive and substrate |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-18T11%3A05%3A34IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=XIA%20YANG&rft.date=2023-11-14&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN117059498A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |