Simple vertical interconnection method and device based on anisotropic conductive adhesive and substrate

The invention provides a simple vertical interconnection method and device based on an anisotropic conductive adhesive, and a substrate. The method comprises the following steps: carrying out a preparation process on an organic interconnection substrate; manufacturing metal layers on the upper surface and the lower surface of the organic interconnection substrate; drilling holes in preset positions of the organic interconnection substrate by using a drilling machine to form through holes, and depositing metal in the through holes of the organic interconnection substrate; attaching the anisotropic conductive adhesive to the upper surface of the organic interconnection substrate; the insulation plane of the anisotropic conductive adhesive is parallel to the upper surface, and the conduction direction is vertical to the upper surface; patterning the metal layers on the upper surface and the lower surface of the organic interconnection substrate; and aligning a pre-prepared chip with the organic interconnection s