Preparation method of semiconductor element

The invention provides a preparation method of a semiconductor element. First, a first isolation layer having a conductive contact is formed on a substrate, and a second isolation layer having an opening is formed on the first isolation layer, where the opening corresponds to and exposes an upper su...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	LIN LIHAN, WANG ZHIQUAN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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