Microelectronic packaging fatigue testing machine based on FPGA (Field Programmable Gate Array) and method thereof

The invention discloses a microelectronic packaging fatigue testing machine based on an FPGA (Field Programmable Gate Array) and a method thereof, and relates to the field of mechanical control. Displacement errors in a testing machine system are eliminated through preprocessing, a machine learning algorithm and an FPGA technology are combined, and the designed control system can process data at a high speed and achieve real-time control. Therefore, the test system is ensured to have quick response and high-precision real-time control capability, displacement errors except the chip are eliminated in real time, the strain rate of a welding spot is kept constant, and displacement compensation is realized. Compared with the traditional method, the system provided by the invention has lower delay and higher precision. Meanwhile, the core method of the system can solve the problem that a traditional motor is low in precision. Therefore, the system not only can ensure the accuracy of the test, but also has universa