Film-laminated metal plate, method for producing same, flexible electronic substrate, and organic EL substrate

Provided are: a film-laminated metal plate which not only satisfies smoothness, heat resistance, flexibility, and gas barrier properties, but also has low environmental burden and excellent productivity; a method for producing the film-laminated metal plate; a substrate for flexible electronics; and a substrate for organic EL. A film-laminated metal plate in which at least one surface is coated with a resin film, in which the arithmetic average roughness (Sa) of the surface of the resin film is 0.030 [mu] m or less, the maximum peak height (Sp) of the surface of the resin film is 0.30 [mu] m or less, and the maximum valley depth (Sv) of the surface of the resin film is 1.0 [mu] m or less. 提供不仅满足平滑性、耐热性、柔性及阻气性而且环境负荷低、生产率也优异的膜层压金属板及其制造方法、以及柔性电子用基板及有机EL用基板。膜层压金属板，其为至少单面由树脂膜被覆的膜层压金属板，前述树脂膜表面的算术平均粗糙度Sa为0.030μm以下，前述树脂膜表面的最大峰高Sp为0.30μm以下，前述树脂膜表面的最大谷深Sv为1.0μm以下。