Memory chip, preparation method of through hole structure, memory and electronic equipment

The embodiment of the invention provides a memory chip, a preparation method of a through hole structure, a memory and electronic equipment. The memory chip comprises a stacked structure, and each layer in the stacked structure comprises one or more memory areas and one or more target redundant area...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	CHEN HUAWEI, FANG YICHEN, DING SHICHENG, BU SITONG
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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