High-integration thick film secondary power supply
A satellite has a high requirement on the light weight of electronic equipment of the satellite. The power supply needs to meet the requirements of small size and high integration level. At present, a thick film hybrid integrated power supply is generally a simple power supply module, the output pow...
Gespeichert in:
Hauptverfasser: | , , , , , |
---|---|
Format: | Patent |
Sprache: | chi ; eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | A satellite has a high requirement on the light weight of electronic equipment of the satellite. The power supply needs to meet the requirements of small size and high integration level. At present, a thick film hybrid integrated power supply is generally a simple power supply module, the output power of the module is generally smaller than 100W, the module only comprises a power conversion part circuit, the integration level is low, more peripheral circuits or modules need to be configured during engineering use, and the miniaturization design requirement of a satellite cannot be met. In order to overcome the defects in the prior art, the invention provides a high-integration thick-film secondary power supply for satellites, an EMI circuit, a current surge suppression circuit, a fusing protection circuit, a multi-path isolation conversion circuit, an interlocking circuit and the like are effectively integrated on a single machine, and the framework that a single device can replace a traditional EMI module an |
---|