Bus inner conductor connection structure, bus structure and GIS equipment
The embodiment of the invention discloses a bus inner conductor connecting structure, a bus structure and GIS equipment, the bus inner conductor connecting structure comprises a conductor, the side wall of the conductor is provided with first heat dissipation holes along the circumferential directio...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The embodiment of the invention discloses a bus inner conductor connecting structure, a bus structure and GIS equipment, the bus inner conductor connecting structure comprises a conductor, the side wall of the conductor is provided with first heat dissipation holes along the circumferential direction; the shielding structure is arranged on the outer side of the conductor in a sleeving mode, convection holes corresponding to the first heat dissipation holes are formed in the shielding structure, and a first heat dissipation cavity for airflow circulation is formed between the shielding structure and the conductor; and the contact seat is inserted into the end part of the conductor, a second heat dissipation hole for air flow to circulate is formed in the contact seat, and the second heat dissipation hole is respectively communicated with the first heat dissipation cavity and the interior of the conductor. According to the bus inner conductor connection structure provided by the invention, the first heat dissip |
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