Working method of chip transfer device

According to the working method of the chip transfer device provided by the invention, when the second carrier plate moving device transfers the second carrier plate, the second carrier plate is adsorbed through the clamping and adsorbing device, and the second carrier plate is clamped through the clamping device, so that the reliability is good; when the LED chips are transferred, adjustment is carried out according to the deviation angle of each LED chip relative to the to-be-attached area, and the LED chips transferred to the second carrier plate are placed according to the preset angle. 本发明提供一种芯片转移装置的工作方法，第二载板搬移装置在转移载板二时，通过夹取吸附装置对载板二进行吸附，通过夹取装置对载板二进行夹持，可靠性好；在转移LED芯片时，根据每一个LED芯片相对待贴合区域的偏移角度分别进行调节，转移到载板二的LED芯片按预设的角度放置。